电线电缆网 > 数据 高频线缆 > USB 2.0 镀金厚度有什么要求（完整版）

USB 2.0 镀金厚度有什么要求 - 无图版

yan --- 2008-03-18 13:52:08

1

各大虾：USB 2.0 镀金厚度有什么要求？
gliet --- 2008-03-19 12:22:00

2

度金，我是不知道，度SN我是知道！

albert0829 --- 2008-03-19 20:12:06

3

下一个USB的规范,里面有接头镀层厚度的要求

Bizlarry --- 2009-03-31 14:06:06

4

cnvito --- 2009-03-31 16:22:20

5

沒有吧

LOG88 --- 2009-04-03 15:26:56

6

15μ或30μ
sbay --- 2009-04-29 17:09:25

7

USB标准里有写的，好像不是15μ或30μ
maohaiya --- 2009-04-29 20:50:51

8

2.0   30u"
sbay --- 2009-04-30 10:15:20

9

6.5.4.3 Plug (Male) Contact Materials
Substrate Material: 0.30 + 0.05 mm half-hard phosphor bronze.
Plating: Contacts are to be selectively plated.
A. Option I
1. Underplate: Minimum 1.25 micrometers (50 microinches) nickel. Copper over base material
is optional.
2. Mating Area: Minimum 0.05 micrometers (2 microinches) gold over a minimum of
0.70 micrometers (28 microinches) palladium.
3. Solder Tails: Minimum 3.8 micrometers (150 microinches) bright tin-lead over the
underplate.
B. Option II
1. Underplate: Minimum 1.25 micrometers (50 microinches) nickel. Copper over base material
is optional.
2. Mating Area: Minimum 0.05 micrometers (2 microinches) gold over a minimum of
0.75 micrometers (30 microinches) palladium-nickel.
3. Wire Crimp/Solder Tails: Minimum 3.8 micrometers (150 microinches) bright tin-lead over
the underplate.
C. Option III
1. Underplate: Minimum 1.25 micrometers (50 microinches) nickel. Copper over base material
is optional.
2. Mating Area: Minimum 0.75 micrometers (30 microinches) gold.
3. Solder Tails: Minimum 3.8 micrometers (150 microinches) bright tin-lead over the
underplate.

sbay --- 2009-04-30 10:17:00

10

是指这一条吗，那应该是0.75um

wdy3830082 --- 2010-03-30 11:56:10

11

USB1.1----插头端子镀金15U"

USB2.0----插头端子镀金30U"

zhou790920 --- 2010-04-06 21:28:39

12

去看SPEC吧，好象有几个option吧。
coolman --- 2010-04-07 09:16:41

13

Thanks
Denny19871011 --- 2020-04-01 14:42:48

14

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