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6.5.4.3 Plug (Male) Contact Materials
Substrate Material: 0.30 + 0.05 mm half-hard phosphor bronze.
Plating: Contacts are to be selectively plated.
A. Option I
1. Underplate: Minimum 1.25 micrometers (50 microinches) nickel. Copper over base material
is optional.
2. Mating Area: Minimum 0.05 micrometers (2 microinches) gold over a minimum of
0.70 micrometers (28 microinches) palladium.
3. Solder Tails: Minimum 3.8 micrometers (150 microinches) bright tin-lead over the
underplate.
B. Option II
1. Underplate: Minimum 1.25 micrometers (50 microinches) nickel. Copper over base material
is optional.
2. Mating Area: Minimum 0.05 micrometers (2 microinches) gold over a minimum of
0.75 micrometers (30 microinches) palladium-nickel.
3. Wire Crimp/Solder Tails: Minimum 3.8 micrometers (150 microinches) bright tin-lead over
the underplate.
C. Option III
1. Underplate: Minimum 1.25 micrometers (50 microinches) nickel. Copper over base material
is optional.
2. Mating Area: Minimum 0.75 micrometers (30 microinches) gold.
3. Solder Tails: Minimum 3.8 micrometers (150 microinches) bright tin-lead over the
underplate.

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USB1.1----²åÍ·¶Ë×Ӷƽð15U"

USB2.0----²åÍ·¶Ë×Ӷƽð30U"