电线电缆网 > 标准共享 > RoHS豁免清单最新整理【中英文版】（完整版）
RoHS豁免清单最新整理【中英文版】 - 无图版
cuijiude --- 2006-10-27 13:41:59
1
ROHS標准在2005年8月和0月對標准做了修改﹐誰有最新版本的標准資料﹐包含附件﹐謝謝﹗急用
绿色甲克虫 --- 2006-10-27 13:48:27
2
0是不是这个？2005颁布ROHS豁免的三份条例1.pdf2005颁布ROHS豁免的三份条例2.pdf2005颁布ROHS豁免的三份条例3.pdf
liugangjian --- 2006-10-27 16:17:35
3
RoHS豁免清单最新整理【中英文版】
Applications of lead, mercury, cadmium and hexavalent chromium, which are exempted from the requirements of Article 4(1) ~/%}U^hIs
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp. `[f$_Rt0oC
2. Mercury in straight fluorescent lamps for general purposes not exceeding: h
\WkC0
— halophosphate 10 mg
nj#} E-
— triphosphate with normal lifetime 5 mg A6* NUVWq
— triphosphate with long lifetime 8 mg. (Mti]`C_^
3. Mercury in straight fluorescent lamps for special purposes. ; Q9''hgR;~
4. Mercury in other lamps not specifically mentioned in this Annex. Hfm=Y]+;
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. -#j[1]q
XY+w
6. Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead wF3C*+mA
by weight and as a copper alloy containing up to 4 % lead by weight. 96Wq rK%
7. — Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead), 7. q}''f=T
— lead in solders for servers, storage and storage array systems (exemption granted until 2010), YW ?,|[
— lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network 0h{>"9ME_
management for telecommunication, xw?Mr`
— lead in electronic ceramic parts (e.g. piezoelectronic devices). olZNjp,h
8. Cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) u p5$4rh
relating to restrictions on the marketing and use of certain dangerous substances and preparations. +bApE@q"G
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators. E cfH_Vd0
10. Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for: a
X hH
— Deca BDE, 8a\< kf(Q
— mercury in straight fluorescent lamps for special purposes, FuX<Uew
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, S^id;
o
signalling, transmission as well as network management for telecommunications (with a view to setting a g2T!`‑
specific time limit for this exemption), and im
xZ eT
— light bulbs, "t;XV$[-B
as a matter of priority in order to establish as soon as possible whether these items are to be amended accordingly. r+tB
liugangjian --- 2006-10-27 16:18:33
4
1．小型日光灯中的汞含量不得超过5毫克/灯； +
g7 +
2．一般用途的直管日光灯中的汞含量不得超过： YZ:2]
nH~
- 盐磷酸盐 10毫克 D &xOJII
- 正常的三磷酸盐 5毫克 5;KV)#C2
- 长效的三磷酸盐 8毫克 0UCjB\D,G
3．特殊用途的直管日光灯中的汞含量； HaZ- jd9;
4．本附录中未特别提及的其它照明灯中的汞含量； 4^xM3O<t_
5．阴极射线管、电子部件和发光管的玻璃内的铅含量； !H,nVzg~9
6．钢中合金元素中的铅含量达0.35%、铝含量达0.4%，铜合金中的铅含量达4%； (;? ''lT;
7．-- 高温融化的焊料中的铅（即：锡铅焊料合金中铅含量超过85%）； 7Y|[1]pnb/Y
-- 用于服务器、存储器和存储系统的焊料中的铅（豁免准予至2010年）； V}x[M1 yp[1]
-- 用于交换、信号和传输，以及电信网络管理的网络基础设施设备中焊料中的铅； i[D Kd
-- 电子陶瓷产品中的铅（例如：高压电子装置）； c*!m,>Q@rt
8．根据修改关于限制特定危险物质和预制品销售和使用的第76/769/EEC 号指令的第91/338/EEC 号指令禁止以外的镉电镀。 4I=u$ Z)j
9．在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。 LoB,4#!)a
10．根据在第7（2）条中提及的程序，欧盟委员会应评价以下方面的应用： {1p
tc=k
-- 台卡二苯醚（Deca BDE）； fJ$eL=]
[1]o
-- 特殊用途的直管日光灯中的汞； }8y0''
-- 以下用途中所使用的焊料中的铅：服务器、存储器、用于交换和传输的网络基础设施、电信网络管理设备（旨在设定本指令豁免部分的特定截止时间）； 5VD[
>=
-- 灯泡。 C/#yf;?
kpR[1]N#@jK
J ` 8=L^
g7 +
2．一般用途的直管日光灯中的汞含量不得超过： YZ:2]
nH~
- 盐磷酸盐 10毫克 D &xOJII
- 正常的三磷酸盐 5毫克 5;KV)#C2
- 长效的三磷酸盐 8毫克 0UCjB\D,G
3．特殊用途的直管日光灯中的汞含量； HaZ- jd9;
4．本附录中未特别提及的其它照明灯中的汞含量； 4^xM3O<t_
5．阴极射线管、电子部件和发光管的玻璃内的铅含量； !H,nVzg~9
6．钢中合金元素中的铅含量达0.35%、铝含量达0.4%，铜合金中的铅含量达4%； (;? ''lT;
7．-- 高温融化的焊料中的铅（即：锡铅焊料合金中铅含量超过85%）； 7Y|[1]pnb/Y
-- 用于服务器、存储器和存储系统的焊料中的铅（豁免准予至2010年）； V}x[M1 yp[1]
-- 用于交换、信号和传输，以及电信网络管理的网络基础设施设备中焊料中的铅； i[D Kd
-- 电子陶瓷产品中的铅（例如：高压电子装置）； c*!m,>Q@rt
8．根据修改关于限制特定危险物质和预制品销售和使用的第76/769/EEC 号指令的第91/338/EEC 号指令禁止以外的镉电镀。 4I=u$ Z)j
9．在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。 LoB,4#!)a
10．根据在第7（2）条中提及的程序，欧盟委员会应评价以下方面的应用： {1p
tc=k
-- 台卡二苯醚（Deca BDE）； fJ$eL=]
[1]o
-- 特殊用途的直管日光灯中的汞； }8y0''
-- 以下用途中所使用的焊料中的铅：服务器、存储器、用于交换和传输的网络基础设施、电信网络管理设备（旨在设定本指令豁免部分的特定截止时间）； 5VD[
>=
-- 灯泡。 C/#yf;?
kpR[1]N#@jK
J ` 8=L^
liugangjian --- 2006-10-27 16:19:53
5
第二批已经确认豁免 发表在2005年10月15日官方杂志上 `x|*K
]2aPsp #O
The Annex to Directive 2002/95/EC is amended as follows: C)7f5&]w(
1. The title is replaced by the following: QUk ->9
‘Applications of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) which are exempted from the requirements of Article 4(1)’; 8[1]YYiB;
o;ez@]''R
2. The following point 9a is added: PJ ?Dw<
‘9a. DecaBDE in polymeric applications;’ +p`
j}AQ ]
K[1]-(DK[
3. The following point 9b is added: ;-p!ohmI
‘9b. Lead in lead-bronze bearing shells and bushes’. }WGy;''
^=,y]SCRY
1． 标题由下列内容取代： !PV#B*N}
铅、镉、汞、六价铬、PBB、PBDE的应用根据需求被豁免： lr4QO)*-}
kXp)@n)VE
2． 在第9条中加入9a P~\zX
a]
聚合体中的十溴二苯醚的应用 vZ*{k@}Vg
J%Rm<:#]
3． 在第9条中加入9b b
\eO8)Lo
铅在铅铜轴承外壳与衬套中 9|[]+n
]2aPsp #O
The Annex to Directive 2002/95/EC is amended as follows: C)7f5&]w(
1. The title is replaced by the following: QUk ->9
‘Applications of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) which are exempted from the requirements of Article 4(1)’; 8[1]YYiB;
o;ez@]''R
2. The following point 9a is added: PJ ?Dw<
‘9a. DecaBDE in polymeric applications;’ +p`
j}AQ ]
K[1]-(DK[
3. The following point 9b is added: ;-p!ohmI
‘9b. Lead in lead-bronze bearing shells and bushes’. }WGy;''
^=,y]SCRY
1． 标题由下列内容取代： !PV#B*N}
铅、镉、汞、六价铬、PBB、PBDE的应用根据需求被豁免： lr4QO)*-}
kXp)@n)VE
2． 在第9条中加入9a P~\zX
a]
聚合体中的十溴二苯醚的应用 vZ*{k@}Vg
J%Rm<:#]
3． 在第9条中加入9b b
\eO8)Lo
铅在铅铜轴承外壳与衬套中 9|[]+n
liugangjian --- 2006-10-27 16:21:14
6
第三批已经确认豁免 发表在2005年10月25日官方杂志上 _ }U({O
q#rfpdpHP"
1. point 7 is replaced by the following: I#C~k6g
%
7. — Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead), 0"LeR1Qj
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, h)OSPL?
signalling, transmission as well as network management for telecommunications, [1]w|QVT^
— lead in electronic ceramic parts (e.g. piezoelectronic devices). R30wj9!2Z\
#=,&n^T`
2. point 8 is replaced by the following: IW`wL
3zg
8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use ofcertain dangerous substances and preparations. Uu~E-L 7F
S？[am-8}
3. the following points are added: 8T|w^X(11). Lead used in compliant pin connector systems. n|Ul+`z_
(12). Lead as a coating material for the thermal conduction module c-ring. F;[ oCcf
(13). Lead and cadmium in optical and filter glass. df''vN
(14). Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight. :dT"P=n-2
(15). Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.’ I Bi b9%>
R]2'';w]Q?Z
|! \ fh1z
1． 原文第7条由以下内容取代 jc高温融化型焊锡铅（如：铅含量≥85%的合金中的铅） X}i(l[1]^
用于服务器，存储器和存储阵列的焊料中的铅。用于交换、信号产生和传输，以及电信网络管理的网络基础设施设备中焊料中的铅。 F-[ -y^O
电子陶瓷部件中的铅（如：piezoelectronic devices） QE%< J\}
2． 原文第8条由以下内容取代 _pf{@h
j
电触点中的镉及镉化合物以及91/338/EEC指令限制范围以外的镉电镀层中的镉 ~!T qdxg
_8/,D,
3． 以下条款将被添加
E^[0zP
（11）顺应针联接系统中使用的铅 KA%G[Q>vc
（12）热导项枪钉模组涂层中所用的铅 +？3"xmciw
（13）光学玻璃及滤光玻璃中所用的铅及镉 ABFX+F@
!
（14）微处理器针脚及封装联接所使用的含有80-85%铅的复合（含有超过两种组分）焊料中的铅 FOzV4{s^.=
（15）倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅 `-{M`D| (
q#rfpdpHP"
1. point 7 is replaced by the following: I#C~k6g
%
7. — Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead), 0"LeR1Qj
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, h)OSPL?
signalling, transmission as well as network management for telecommunications, [1]w|QVT^
— lead in electronic ceramic parts (e.g. piezoelectronic devices). R30wj9!2Z\
#=,&n^T`
2. point 8 is replaced by the following: IW`wL
3zg
8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use ofcertain dangerous substances and preparations. Uu~E-L 7F
S？[am-8}
3. the following points are added: 8T|w^X
(12). Lead as a coating material for the thermal conduction module c-ring. F;[ oCcf
(13). Lead and cadmium in optical and filter glass. df''vN
(14). Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight. :dT"P=n-2
(15). Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.’ I Bi b9%>
R]2'';w]Q?Z
|! \ fh1z
1． 原文第7条由以下内容取代 jc
用于服务器，存储器和存储阵列的焊料中的铅。用于交换、信号产生和传输，以及电信网络管理的网络基础设施设备中焊料中的铅。 F-[ -y^O
电子陶瓷部件中的铅（如：piezoelectronic devices） QE%< J\}
j
电触点中的镉及镉化合物以及91/338/EEC指令限制范围以外的镉电镀层中的镉 ~!T qdxg
_8/,D,
3． 以下条款将被添加
E^[0zP
（11）顺应针联接系统中使用的铅 KA%G[Q>vc
（12）热导项枪钉模组涂层中所用的铅 +？3"xmciw
（13）光学玻璃及滤光玻璃中所用的铅及镉 ABFX+F@
!
（14）微处理器针脚及封装联接所使用的含有80-85%铅的复合（含有超过两种组分）焊料中的铅 FOzV4{s^.=
（15）倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅 `-{M`D| (
liugangjian --- 2006-10-27 16:21:56
7
RoHS：进一步豁免 2004年12月提交相关方咨询2月11日止(正在审议中)： @n''Euk0
A further 22 proposed exemptions are under a Commission consultation, which closes on 11 February 2005: <3ra(~b''
1．Lead in tin whisker resistant coatings for fine pitch (<0.65 mm) applications (e.g. connectors). AtD{pyx.t
2．Lead bound in glass, crystal glass, lead crystal or full lead crystal in general. Tj )C^>8S
3．Chromium (VI) and cadmium as colouring agents (up to 2 % content) in glass, crystal glass, lead crystal or full lead crystal for decorative and/or functional use. 0meRpS8
4．Solders containing lead and/or cadmium for specific applications. 9'' _ q0g
5．Hexavalent chromium anti-corrosion coatings. _{m''wk%
6．Lead oxide glass in plasma display panels. Ar[
cmO8a
7．Lead in connectors, flexible printed circuits, flexible flat cables. ps
BJ
8．Lead glass used for magnetic heads (e.g. VCRs). R I(-IXO:7
9．Cadmium as a doping material in avalanche photodiodes (APDs) for optical fibre communications. oYo#[ .aN
10．Lead in optical isolators. ]g
,l/NF
11．Lead glass seals in the sheath heater of microwaves. [1]Op@{QnxT
12．Cadmium pigments (except for those banned by the Cadmium Directive 91/338/EEC.
6 b@ -d？^
13．Lead halide (iodide) as a radiant agent in high intensity discharge (HID) lamps for professional UV applications (e.g. lamps used for curing, reprography and label printing). [1]00R^W$/
14．Lead activators in the phosphors used for specialised straight and compact fluorescent lamps (e.g. lamps for sun tanning, diazo-printing, reprography, lithography, insect traps). 9V(QY$X？
15．Lead as an amalgam in discharge lamps (e.g. small compact energy-saving fluorescent lamps). ''vS-l
z
16．Lead in glass solder used for mercury-free flat panel lamps. Wg''lmyq?
17．Lead in the glass envelope of Black Light Blue (BLB) UV lamps (BLB lamps are used for money checking, leak detection, disco lighting etc). .l{ 1
18．Lead in low melting point alloys (e.g. second soldering operations on a printed circuit board (PCB) and safety and other temperature dependant switching devices. Tmv?%vK[1]
19．Lead in galvanised steel (up to 0.35% lead) and aluminium (up to 0.4 % unintended lead). BK`U"hhrA
20．Lead in solder and hexavalent chromium in surface treatments in parts recovered from non-household printers & copying equipment which were originally placed on the market before 1 July 2006, and are reused as part of the original equipment manufacturer’s closed loop system until 1 July 2011. YR &q&q[
21．Cadmium sulphide photocells. Dx:H83^2
22．Light sensors which mimic the human eye, such as daylight-responsive dimming systems for lighting. rib8LC`2
23．Aeronautic and aerospace sector applications that require high safety standards for any of the RoHS restricted substances. (Clarifying that EEE in these sectors is exempt from the RoHS Directive. Such EEE is excluded from the WEEE by falling outside the 10 WEEE categories.) %]d)
A further 22 proposed exemptions are under a Commission consultation, which closes on 11 February 2005: <3ra(~b''
1．Lead in tin whisker resistant coatings for fine pitch (<0.65 mm) applications (e.g. connectors). AtD{pyx.t
2．Lead bound in glass, crystal glass, lead crystal or full lead crystal in general. Tj )C^>8S
3．Chromium (VI) and cadmium as colouring agents (up to 2 % content) in glass, crystal glass, lead crystal or full lead crystal for decorative and/or functional use. 0meRpS8
4．Solders containing lead and/or cadmium for specific applications. 9'' _ q0g
5．Hexavalent chromium anti-corrosion coatings. _{m''wk%
6．Lead oxide glass in plasma display panels. Ar[
cmO8a
7．Lead in connectors, flexible printed circuits, flexible flat cables. ps
BJ
8．Lead glass used for magnetic heads (e.g. VCRs). R I(-IXO:7
9．Cadmium as a doping material in avalanche photodiodes (APDs) for optical fibre communications. oYo#[ .aN
10．Lead in optical isolators. ]g
,l/NF
11．Lead glass seals in the sheath heater of microwaves. [1]Op@{QnxT
12．Cadmium pigments (except for those banned by the Cadmium Directive 91/338/EEC.
6 b@ -d？^
13．Lead halide (iodide) as a radiant agent in high intensity discharge (HID) lamps for professional UV applications (e.g. lamps used for curing, reprography and label printing). [1]00R^W$/
14．Lead activators in the phosphors used for specialised straight and compact fluorescent lamps (e.g. lamps for sun tanning, diazo-printing, reprography, lithography, insect traps). 9V(QY$X？
15．Lead as an amalgam in discharge lamps (e.g. small compact energy-saving fluorescent lamps). ''vS-l
z
16．Lead in glass solder used for mercury-free flat panel lamps. Wg''lmyq?
17．Lead in the glass envelope of Black Light Blue (BLB) UV lamps (BLB lamps are used for money checking, leak detection, disco lighting etc). .l{ 1
18．Lead in low melting point alloys (e.g. second soldering operations on a printed circuit board (PCB) and safety and other temperature dependant switching devices. Tmv?%vK[1]
19．Lead in galvanised steel (up to 0.35% lead) and aluminium (up to 0.4 % unintended lead). BK`U"hhrA
20．Lead in solder and hexavalent chromium in surface treatments in parts recovered from non-household printers & copying equipment which were originally placed on the market before 1 July 2006, and are reused as part of the original equipment manufacturer’s closed loop system until 1 July 2011. YR &q&q[
21．Cadmium sulphide photocells. Dx:H83^2
22．Light sensors which mimic the human eye, such as daylight-responsive dimming systems for lighting. rib8LC`2
23．Aeronautic and aerospace sector applications that require high safety standards for any of the RoHS restricted substances. (Clarifying that EEE in these sectors is exempt from the RoHS Directive. Such EEE is excluded from the WEEE by falling outside the 10 WEEE categories.) %]d)
liugangjian --- 2006-10-27 16:22:57
8
1． 小螺距应用中在抗锡须涂料中的铅 _？_ N
T
2． 玻璃、晶体玻璃、铅晶体或全铅晶体中的铅 C ;FMQN
3． 在玻璃、晶体玻璃、铅晶体或全铅晶体中作为着色添加剂且含量达到2%的铬（也包括六价铬）和镉，这些玻璃等作为电子电气设备的装饰性和/或功能性的一部分 \lKude5=&I
4． 特殊用途的焊料，含铅和/或镉 @* RNY:？
5． 六价铬钝化涂膜 24t$？69@
6． 氧化铅玻璃等离子显示板中的铅 =j? M^%w
7． 连接器、柔性印刷电路、柔性扁平电缆中的铅 e4B_\7}
8． 铅化玻璃、磁头的粘接材料及磁头中的氧化铅 V
xGym
9． 光纤通讯系统用雪崩二极管中作为搀杂材料的镉 =T#_*su
10． 光隔离器中的铅 $yx4qm7
11． 微波铠装加热器中的铅 `)==i^ @
12． 镉颜料，除91/338/EEC指令（修订76/769/EEC关于限制某些物质的销售和使用指令）禁止的应用外 I>6.< !H
13． 专业紫外线应用中的高强度放电灯，含有卤化铅作为辐射剂 ]J2^s5
14． 特殊用途的放电灯， 在荧光粉中含有铅（重量比1%或以下）作为激活剂 u9;w&BCV
15． 放电灯，以汞齐剂形式含有铅 .;
nkj5 6
16． 平板灯中的汞 7a/i$Uo~dY
17． 特殊用途紫外线灯，有玻璃外壳中含铅 2.M%(8
HwQ
18． 含铅的低熔点合金 m N# *R/B
19． 电子电气设备中的电镀钢含铅（重量比）达到0.35%，以及铝作为杂质的铅含量达0.4%。 9`EG~o`+
20． 焊料中的铅和表面处理中的六价铬，以及在从打印机和复印设备中回收的部件中的铅和六价铬。这些部件是从专业用户而不是私人家庭收回的，且是2006年7月1日前投放市场的，在原始制造商的闭环系统内作为相同目的重新使用的。在这里，闭环系统是指，在该系统内设备仍是制造商的财产，或者经受其它的合同安排，且在合同到期或设备寿命终结时被返回给制造商。直到2011年7月1日。 >-6F#
Z^
21． 硫化镉光电池 tT>9@ sL
22． 应用在模拟假眼睛中的光感应元件。 4p-">f>
23． 用在需要较高安全标准的航天和航空行业的电子电气设备中的铅、汞、镉、六价铬、PBB和PBDE. Wk{]&A
T
2． 玻璃、晶体玻璃、铅晶体或全铅晶体中的铅 C ;FMQN
3． 在玻璃、晶体玻璃、铅晶体或全铅晶体中作为着色添加剂且含量达到2%的铬（也包括六价铬）和镉，这些玻璃等作为电子电气设备的装饰性和/或功能性的一部分 \lKude5=&I
4． 特殊用途的焊料，含铅和/或镉 @* RNY:？
5． 六价铬钝化涂膜 24t$？69@
6． 氧化铅玻璃等离子显示板中的铅 =j? M^%w
7． 连接器、柔性印刷电路、柔性扁平电缆中的铅 e4B_\7}
8． 铅化玻璃、磁头的粘接材料及磁头中的氧化铅 V
xGym
9． 光纤通讯系统用雪崩二极管中作为搀杂材料的镉 =T#_*su
10． 光隔离器中的铅 $yx4qm7
11． 微波铠装加热器中的铅 `)==i^ @
12． 镉颜料，除91/338/EEC指令（修订76/769/EEC关于限制某些物质的销售和使用指令）禁止的应用外 I>6.< !H
13． 专业紫外线应用中的高强度放电灯，含有卤化铅作为辐射剂 ]J2^s5
14． 特殊用途的放电灯， 在荧光粉中含有铅（重量比1%或以下）作为激活剂 u9;w&BCV
15． 放电灯，以汞齐剂形式含有铅 .;
nkj5 6
16． 平板灯中的汞 7a/i$Uo~dY
17． 特殊用途紫外线灯，有玻璃外壳中含铅 2.M%(8
HwQ
18． 含铅的低熔点合金 m N# *R/B
19． 电子电气设备中的电镀钢含铅（重量比）达到0.35%，以及铝作为杂质的铅含量达0.4%。 9`EG~o`+
20． 焊料中的铅和表面处理中的六价铬，以及在从打印机和复印设备中回收的部件中的铅和六价铬。这些部件是从专业用户而不是私人家庭收回的，且是2006年7月1日前投放市场的，在原始制造商的闭环系统内作为相同目的重新使用的。在这里，闭环系统是指，在该系统内设备仍是制造商的财产，或者经受其它的合同安排，且在合同到期或设备寿命终结时被返回给制造商。直到2011年7月1日。 >-6F#
Z^
21． 硫化镉光电池 tT>9@ sL
22． 应用在模拟假眼睛中的光感应元件。 4p-">f>
23． 用在需要较高安全标准的航天和航空行业的电子电气设备中的铅、汞、镉、六价铬、PBB和PBDE. Wk{]&A
liugangjian --- 2006-10-27 16:23:47
9
RoHS：进一步豁免 (正在审议中)： :t=:/-ZW
1 Linear incandescent lamp. 14(b？iq,
2 Mercury in switches. u3 Special ICs having tin-lead solder plating on leads used in professional equipment. V''clEFw
4 Specific modular units including tin-lead solder being used in special professional equipment. [jA#7fNl
5 Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours. \tc/''z <
6 Lead in solder for printed circuit boards for emergency lighting products. Y-L-/`E7 Hexavalent chromium (Cr-VI) in chromate conversion coatings as surface treatment. $|-R9-@
8 Lead in gas sensors. wK.Va?I(
9 Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) lamps in LCD TVs. tXGZ4?W
TW
10 Cadmium in opto-electronic components. $Q-U>k
11 Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical/electronic components for safe control and operation. )*A$S[1]B:
12 Electrical and electronic components contained in heating ventilating and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems. +J:5o]13 Cadmium-bearing copper alloys. r5
I[1]m~ e
14 Electrical/electronic components contained mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor’s air tools. t8ilX.qK
15 Electrical/electronic equipment that are: used in transport -aviation, aerospace, road, maritime, rail; installed in to the fabric of buildings – elevators, escalators, moving walks, dumb waiters, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; and used in military applications. Uh2AC_#pj
16 Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and -c5?,Z+a
commercial loudspeakers. C b^SKFL
17 Cadmium oxide. c~*P''t+?
18 Solder tin of the thermo fuse with a defined low melting point. m-'' M(6
19 Lead in lead oxide glass used in plasma display panel (PDP). }C|{%
+8(
20 Lead in solder on small PCB and tinned legs of primary components. bdMuae6&
j
21 Use of the not lead free component NEC V25 in the Memor 2000. C ?
a^
22 Lead used in shielding of radiation for Non Medical X-ray equipment. 02T-jxZED
23 Lead based solders sealed or captured within heat-shrinkable components and devices. [1]
1 Linear incandescent lamp. 14(b？iq,
2 Mercury in switches. u
4 Specific modular units including tin-lead solder being used in special professional equipment. [jA#7fNl
5 Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours. \tc/''z <
6 Lead in solder for printed circuit boards for emergency lighting products. Y-L-/`E
8 Lead in gas sensors. wK.Va?I(
9 Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) lamps in LCD TVs. tXGZ4?W
TW
10 Cadmium in opto-electronic components. $Q-U>k
11 Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical/electronic components for safe control and operation. )*A$S[1]B:
12 Electrical and electronic components contained in heating ventilating and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems. +J:5o]
I[1]m~ e
14 Electrical/electronic components contained mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor’s air tools. t8ilX.qK
15 Electrical/electronic equipment that are: used in transport -aviation, aerospace, road, maritime, rail; installed in to the fabric of buildings – elevators, escalators, moving walks, dumb waiters, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; and used in military applications. Uh2AC_#pj
16 Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and -c5?,Z+a
commercial loudspeakers. C b^SKFL
17 Cadmium oxide. c~*P''t+?
18 Solder tin of the thermo fuse with a defined low melting point. m-'' M(6
19 Lead in lead oxide glass used in plasma display panel (PDP). }C|{%
+8(
20 Lead in solder on small PCB and tinned legs of primary components. bdMuae6&
j
21 Use of the not lead free component NEC V25 in the Memor 2000. C ?
a^
22 Lead used in shielding of radiation for Non Medical X-ray equipment. 02T-jxZED
23 Lead based solders sealed or captured within heat-shrinkable components and devices. [1]
liugangjian --- 2006-10-27 16:24:47
10
1．线性白炽灯 ''(N*y s
2．开关中的汞 p&O%?YUEH
3．专业设备所用特殊IC引脚覆盖的锡铅焊料镀层 >68 6Y9qJ
4． 含有锡铅焊料的特殊模块单元 \;8="X \
5． 含有铅和/或镉的焊料，应用在温度高于150摄氏度需要持续工作500小时的特殊设备中 B pt}!}8
6．应急灯的PCB板的焊料中的铅 9{`~/
R
7．用作表面处理的铬酸盐转换料的六价铬 ~W_AiT h[
8．气体传感器的铅 u56!cv
9．紫蓝灯管中的氧化铝（密封玻璃中的铅） +KAG_[-\O
10．光电部件中的镉 Eh<_e`pke
11．非消费目的的机械电力传输系统（包括用电子电气部件控制安全和运作的减速器和机械耦合器） rH2t？z$!
12．加热通风设备，空气调节系统，商业用冷却系统和运输用冷却系统的电子电气部件 %/sc\2@U
13．含镉铜合金 7$2`p[Q]
m
14．包含电子电气部件的移动或固定空气压缩机的真空吸尘系统，压缩空气污染物清除系统以及气动工具 g"uF5T3C_
–高功率专业及商业用喇叭的传感器的电子、机械焊料的铅合金 u,"s3&-hYb
–以下用途的电子电气设备：运输－航空、航天、陆、海、铁路安装到建筑物的－升降电梯、电动扶梯、移动带、小型升降机、加热、冷却和通风系统、防火安全系统、用于能源生产和传送、用于采矿和矿物加工、非消费商业用途的电力传输系统、工业加工泵和压缩机、用于工业冰箱、用于军功设施 W} qlUq
17．氧化镉 Ff Nh''-4>b
18．低熔点热熔丝的焊锡 ？
z`
^G
19．等离子显示器中氧化铅玻璃中的铅 >x*#i}
20．小的PCB和镀锡元件焊料中的铅（红外成像仪中） q''$)U!CgCL
21．Memor2000中非无铅元件NEC25的使用 -!/_L}n(mD
22．非医疗用X射线设备中辐射防护部件中的铅 Ow5jV\px 1
23．密封于热收缩元件装置中的铅焊料 Z JM
2．开关中的汞 p&O%?YUEH
3．专业设备所用特殊IC引脚覆盖的锡铅焊料镀层 >68 6Y9qJ
4． 含有锡铅焊料的特殊模块单元 \;8="X \
5． 含有铅和/或镉的焊料，应用在温度高于150摄氏度需要持续工作500小时的特殊设备中 B pt}!}8
6．应急灯的PCB板的焊料中的铅 9{`~/
R
7．用作表面处理的铬酸盐转换料的六价铬 ~W_AiT h[
8．气体传感器的铅 u5
9．紫蓝灯管中的氧化铝（密封玻璃中的铅） +KAG_[-\O
10．光电部件中的镉 Eh<_e`pke
11．非消费目的的机械电力传输系统（包括用电子电气部件控制安全和运作的减速器和机械耦合器） rH2t？z$!
12．加热通风设备，空气调节系统，商业用冷却系统和运输用冷却系统的电子电气部件 %/sc\2@U
13．含镉铜合金 7$2`p[Q]
m
14．包含电子电气部件的移动或固定空气压缩机的真空吸尘系统，压缩空气污染物清除系统以及气动工具 g"uF5T3C_
–高功率专业及商业用喇叭的传感器的电子、机械焊料的铅合金 u,"s3&-hYb
–以下用途的电子电气设备：运输－航空、航天、陆、海、铁路安装到建筑物的－升降电梯、电动扶梯、移动带、小型升降机、加热、冷却和通风系统、防火安全系统、用于能源生产和传送、用于采矿和矿物加工、非消费商业用途的电力传输系统、工业加工泵和压缩机、用于工业冰箱、用于军功设施 W} qlUq
17．氧化镉 Ff Nh''-4>b
18．低熔点热熔丝的焊锡 ？
z`
^G
19．等离子显示器中氧化铅玻璃中的铅 >x*#i}
20．小的PCB和镀锡元件焊料中的铅（红外成像仪中） q''$)U!CgCL
21．Memor2000中非无铅元件NEC25的使用 -!/_L}n(mD
22．非医疗用X射线设备中辐射防护部件中的铅 Ow5jV\px 1
23．密封于热收缩元件装置中的铅焊料 Z JM
cuijiude --- 2006-10-28 11:24:12
11
谢谢了请版主奖励积分吧
追梦 --- 2006-11-24 10:48:03
12
我这里需要的是ROHS标准具体的要求内容，谁有呀？可以发给我吧！
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